SMT REFLOW OVEN TWS AUTOMATION

Reflow ovens, curing, dehumidification for electronic SMT components

TWS AUTOMATION offers a full line of reflow ovens dedicated to SMT PCB prototypes, small, and medium series.
Reflow ovens are compatible with lead-free technology Rohs.
These ovens are designed to reflow the solder paste or polymerization of resins and adhesives.
The heater is full convection and heating elements are controlled by a PID. The electronic temperature is like Burst Firing allowing to work with high temperature used in lead-free solder process.
Many features are included as standard such as storing programs for displaying different instructions, information display by LCD, the profiler with 4 temperature thermocouples for temperature measurement on the actual profile, a display window at the solder reflow chamber.
For model input / output, the conveyor is made by a metal mesh belt or by a conveyor chains.
These are high quality ovens with a minimization of energy consumption.

They are fully compliant with the standard EMI electromagnetic interference

TWS1150 2 zones + 1 cooling zone Convection 7 KW / tunnel 1 m Mesch conveyor Max PCB width : 400mm 230V or 380V	TWS1250 3 zones + 1 cooling zone Convection 9 KW / tunnel 1,5 m Flip opening upper tunnel Mesch conveyor Max PCB width : 400mm 230V ou 380V	TWS 1320 4 zones + 1 cooling zone Convection 11 KW / tunnel 2 m PID Temperature Control to 350°C Max Mesch conveyor Max PCB width : 400mm 230V or 380V
TWS 1380 4 zones + 1 cooling zone Convection 11 KW / tunnel 2 m PID Temperature Control to 350°C Max Temperature profiler 4 channels Flip opening upper tunnel Mesch conveyor Max PCB width : 400mm 230V oru 380V	TWS 1390 4 zones + 1 cooling zone Convection 11 KW / tunnel 2 m PID Temperature Control to 350°C Max Temperature profiler 4 channels Flip opening upper tunnel Chain conveyor Max PCB width : 320mm 230V oru 380V	Air convection systemr All ovens use the hot air convection system Convection is on the side

Benchtop model - TWS 850 Used for : soldering prototypes et the very small PCB batches Curing adhesive Hot baking PCB's Full convection model Setup is via a touchscreen. Optional soldering in nitrogen

The oven enables to solder boards up to 330 mm length and 240 mm widht.
Heating of the board is obtained by forced convection of hot air, a well-proven system, giving the best compromise among quality, productivity, consumption and dimensions.
Easy to use and with good performance, TWS 850 / 850N2 is a cheaper oven who allows to do solder operation in a really short time.
Even if able to solder very large boards, the oven structure has been design to be a bench-top type, to install it easily even in narrow spaces and thus is ideal for laboratories.
The electronic control system is designed to minimise power consumption.
Even if is a small oven it is possible to obtain a great variety of thermal profiles so as to fulfil the most demanding request.
The oven’s main parameters are constantly monitored by the Touch screen LCD display , always indicating the instruction for the operator and following parameters:


- Temperature set-point for each heating phase,
- Actual temperature for each heating phase.


The forced convection of air is on horizontal line, this due to a fan that blows the air from the inside to the surroundings. The air flux is calculated to not shift those components from their original position.
The actual temperature of the heater is monitored by computer and a built-in K-type thermocouple.